Professional PCB Manufacturer
Professional PCB Manufacturer
The pricing of a bespoke PCB and the variables that affect it will be covered in this article.
Choosing the right packaging form for integrated circuits is crucial in electronics. BGA and QFN offer distinct features and applications. Factors like pin density, thermal management, and repair ease guide the choice. Transitioning from QFN to BGA may address higher pin density, thermal needs, and market trends, balancing design and cost considerations.
Ensuring the reliability and quality of printed circuit boards relies heavily on solderability testing, which evaluates the ability of PCB components to form robust solder joints.
Printed Circuit Boards form the backbone of modern electronic devices, facilitating the seamless transmission of signals across various components.
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.
Immersion gold PCBs are commonly used in high-reliability applications, such as telecommunications and medical devices.
Two types of copper foils are used for the copper used in substrates. One is "electrolytic copper foil" used for rigid boards, and the other is "rolled copper foil" used for flexible and high-current boards.
This article aims to provide a comprehensive understanding of PCB thickness, factors affecting PCB thickness, and how to choose the right pcb thickness.
The stiffeners PCB mainly include stainless steel stiffeners PCB, aluminum foil stiffeners PCB, polyester stiffeners PCB, polyimide stiffeners PCB and glass fiber stiffeners PCB.
There is no such thing as a standard printed circuit board as each PCB has a single function for a particular product. Producing a PCB is a complex multi-step process. Here, we look at the most important steps in producing a multilayer PCB.
Modern electronics use Ball Grid Array technology (BGA) for its high efficiency and performance. This post discusses the differences between SMD and NSMD pads in BGA designs that are important to optimize PCB functionality.
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