Professional PCB Manufacturer

China PCB Manufacturer
You are here:

News

Differences Between VCC, VEE, VDD, and VSS in Electronics Circuits 2024-09-18

In electronics, the terms VCC, VEE, VDD, and VSS are frequently used to describe different power supply voltages in circuits. These designations are essential for understanding the supply roles and the correct functioning of components like bipolar junction transistors (BJTs) and field-effect transistors (FETs).

How to Build a Detailed BOM (Bill of Materials) for PCB Manufacturing 2024-09-12

In PCB manufacturing, engineers need a Bill of Materials (BOM) to organize every component required for their product. A BOM is a vital document for tracking parts, managing inventory, and ensuring production accuracy.

PCB Mounting Holes: Comprehensive Guide to Types and Design Tips 2024-08-28

PCB mounting holes play a vital role in securing printed circuit boards to their enclosures or other surfaces. They ensure that the board remains stable, reducing the risk of damage due to movement or environmental factors.

What is PCB Back Drilling? Benefits and Applications in PCB Design 2024-08-24

PCB back drilling is an essential technique in high-speed printed circuit board design to ensure signal integrity. As devices transmit data at increasingly faster rates, small imperfections, like unused sections of vias

Understanding Blind and Buried Vias in PCB Design 2024-07-31

Blind vias and buried vias optimize space and functionality in multilayer PCBs, essential for high-density designs that enable complex and efficient layouts.

The Comprehensive Guide to ENIG (Electroless Nickel Immersion Gold) PCB 2024-07-23

Explore the world of Electroless Nickel Immersion Gold PCBs. Understand their advantages, how they compare with HASL surface finishes, and their growing importance in various industries.

How Much Does A Custom PCB Cost 2024-06-17

The pricing of a bespoke PCB and the variables that affect it will be covered in this article.

BGA vs. QFN: Choosing the Right Packaging 2024-06-11

Choosing the right packaging form for integrated circuits is crucial in electronics. BGA and QFN offer distinct features and applications. Factors like pin density, thermal management, and repair ease guide the choice. Transitioning from QFN to BGA may address higher pin density, thermal needs, and market trends, balancing design and cost considerations.

Complete Guide to PCB Solderability Testing for Reliable Connections 2024-05-29

Ensuring the reliability and quality of printed circuit boards relies heavily on solderability testing, which evaluates the ability of PCB components to form robust solder joints.

Microstrip vs. Stripline: Detailed Comparison for PCB Designers 2024-05-22

Printed Circuit Boards form the backbone of modern electronic devices, facilitating the seamless transmission of signals across various components.

Optimizing PCB Designs with Microvias: A Comprehensive Guide 2024-05-20

One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.

×

Contact Us

×

Inquire

*Name
*Email
Company Name
Tel
*Message

By continuing to use the site you agree to our privacy policy Terms and Conditions.

Recruit global agents and distributors Join us

I agree